Please use this identifier to cite or link to this item:
https://hdl.handle.net/20.500.14279/33096
Title: | Silicon Carbide n-IGBTs: Structure Optimization for Ruggedness Enhancement | Authors: | Almpanis, Ioannis Antoniou, Marina Evans, Paul Empringham, Lee Gammon, Peter Undrea, Florin Mawby, Philip Lophitis, Neophytos |
Major Field of Science: | Engineering and Technology | Keywords: | dV/dt;insulated-gate bipolar transistor (IGBT);ruggedness;short circuit;silicon carbide (SiC);TCAD simulation;unintentional turn-on | Issue Date: | 13-Jan-2024 | Source: | IEEE Transactions on Industry Applications, 2024, vol. 60, iss. 3, pp. 4251 - 4263 | Volume: | 60 | Issue: | 3 | Start page: | 4251 | End page: | 4263 | Journal: | IEEE Transactions on Industry Applications | Abstract: | In recent years, silicon carbide (SiC) based devices are increasingly replacing their silicon counterparts in power conversion applications due to their performance superiority. SiC insulated-gate bipolar transistors are particularly interesting as they appear to be the most appropriate for medium and high voltage applications due to their low on-state voltage drop for devices rated at 10kV or higher. However, the widespread adoption of SiC IGBT requires rugged devices capable of surviving in harsh conditions. By using Sentaurus TCAD and validated models based on published experimental results, the short-circuit, unintentional turn-on and dV/dt ruggedness of SiC IGBTs are comprehensively explored and the impact of device parameters on the overall IGBT ruggedness were identified. This paper aims to propose the most efficient methods for IGBT ruggedness enhancement on the device level. | URI: | https://hdl.handle.net/20.500.14279/33096 | ISSN: | 00939994 | DOI: | 10.1109/TIA.2024.3354870 | Rights: | Attribution-NonCommercial-NoDerivatives 4.0 International | Type: | Article | Affiliation : | University of Nottingham University of Warwick University of Cambridge |
Publication Type: | Peer Reviewed |
Appears in Collections: | Άρθρα/Articles |
CORE Recommender
This item is licensed under a Creative Commons License