Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.14279/33096
Title: Silicon Carbide n-IGBTs: Structure Optimization for Ruggedness Enhancement
Authors: Almpanis, Ioannis 
Antoniou, Marina 
Evans, Paul 
Empringham, Lee 
Gammon, Peter 
Undrea, Florin 
Mawby, Philip 
Lophitis, Neophytos 
Major Field of Science: Engineering and Technology
Keywords: dV/dt;insulated-gate bipolar transistor (IGBT);ruggedness;short circuit;silicon carbide (SiC);TCAD simulation;unintentional turn-on
Issue Date: 13-Jan-2024
Source: IEEE Transactions on Industry Applications, 2024, vol. 60, iss. 3, pp. 4251 - 4263
Volume: 60
Issue: 3
Start page: 4251
End page: 4263
Journal: IEEE Transactions on Industry Applications 
Abstract: In recent years, silicon carbide (SiC) based devices are increasingly replacing their silicon counterparts in power conversion applications due to their performance superiority. SiC insulated-gate bipolar transistors are particularly interesting as they appear to be the most appropriate for medium and high voltage applications due to their low on-state voltage drop for devices rated at 10kV or higher. However, the widespread adoption of SiC IGBT requires rugged devices capable of surviving in harsh conditions. By using Sentaurus TCAD and validated models based on published experimental results, the short-circuit, unintentional turn-on and dV/dt ruggedness of SiC IGBTs are comprehensively explored and the impact of device parameters on the overall IGBT ruggedness were identified. This paper aims to propose the most efficient methods for IGBT ruggedness enhancement on the device level.
URI: https://hdl.handle.net/20.500.14279/33096
ISSN: 00939994
DOI: 10.1109/TIA.2024.3354870
Rights: Attribution-NonCommercial-NoDerivatives 4.0 International
Type: Article
Affiliation : University of Nottingham 
University of Warwick 
University of Cambridge 
Publication Type: Peer Reviewed
Appears in Collections:Άρθρα/Articles

CORE Recommender
Show full item record

Google ScholarTM

Check

Altmetric


This item is licensed under a Creative Commons License Creative Commons