Please use this identifier to cite or link to this item:
https://hdl.handle.net/20.500.14279/19445
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nabeel, Mohammed | - |
dc.contributor.author | Ashraf, Mohammed | - |
dc.contributor.author | Patnaik, Satwik | - |
dc.contributor.author | Soteriou, Vassos | - |
dc.contributor.author | Sinanoglu, Ozgur | - |
dc.contributor.author | Knechtel, Johann | - |
dc.date.accessioned | 2020-11-20T06:15:02Z | - |
dc.date.available | 2020-11-20T06:15:02Z | - |
dc.date.issued | 2020-11-01 | - |
dc.identifier.citation | IEEE Transactions on Computers, 2020, vol. 69, no. 11, pp. 1611-1625 | en_US |
dc.identifier.issn | 15579956 | - |
dc.identifier.uri | https://hdl.handle.net/20.500.14279/19445 | - |
dc.description.abstract | For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries. More specifically, we integrate chiplets (i.e., third-party hard intellectual property of complex functionality, like microprocessors) using a security-enforcing interposer. Such hardware organization provides a robust 2.5D root of trust for trustworthy, yet powerful and flexible, computation systems. The security paradigms for our scheme, employed firmly by design and construction, are: 1) stringent physical separation of trusted from untrusted components and 2) runtime monitoring. The system-level activities of all untrusted commodity chiplets are checked continuously against security policiesvia physically separated security features. Aside from the security promises, the good economics of outsourced supply chains are still maintained; the system vendor is free to procure chiplets from the open market, while only producing the interposer and assembling the 2.5D system oneself. We showcase our scheme using the Cortex-M0 core and the AHB-Lite bus by ARM, building a secure 64-core system with shared memories. We evaluate our scheme through hardware simulation, considering different threat scenarios. Finally, we devise a physical-design flow for 2.5D systems, based on commercial-grade design tools, to demonstrate and evaluate our 2.5D root of trust. | en_US |
dc.format | en_US | |
dc.language.iso | en | en_US |
dc.relation.ispartof | IEEE Transactions on Computers | en_US |
dc.rights | © IEEE | en_US |
dc.rights | Attribution-NonCommercial-NoDerivatives 4.0 International | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/4.0/ | * |
dc.subject | Security | en_US |
dc.subject | Integrated circuits | en_US |
dc.subject | Three-dimensional displays | en_US |
dc.subject | Hardware | en_US |
dc.subject | Runtime | en_US |
dc.subject | Monitoring | en_US |
dc.subject | Supply chains | en_US |
dc.subject | Hardware security | en_US |
dc.subject | 2.5D integration | en_US |
dc.subject | Active interposer | en_US |
dc.subject | Chiplets | en_US |
dc.subject | Multi-core system | en_US |
dc.subject | Runtime monitoring | en_US |
dc.subject | Policies | en_US |
dc.title | 2.5D Root of Trust: Secure System-Level Integration of Untrusted Chiplets | en_US |
dc.type | Article | en_US |
dc.collaboration | New York University Abu Dhabi | en_US |
dc.collaboration | New York University | en_US |
dc.collaboration | Cyprus University of Technology | en_US |
dc.subject.category | Electrical Engineering - Electronic Engineering - Information Engineering | en_US |
dc.journals | Subscription | en_US |
dc.country | United Arab Emirates | en_US |
dc.country | USA | en_US |
dc.country | Cyprus | en_US |
dc.subject.field | Engineering and Technology | en_US |
dc.publication | Peer Reviewed | en_US |
dc.identifier.doi | 10.1109/TC.2020.3020777 | en_US |
dc.relation.issue | 11 | en_US |
dc.relation.volume | 69 | en_US |
cut.common.academicyear | 2020-2021 | en_US |
dc.identifier.spage | 1611 | en_US |
dc.identifier.epage | 1625 | en_US |
item.openairetype | article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.languageiso639-1 | en | - |
item.fulltext | No Fulltext | - |
crisitem.author.dept | Department of Electrical Engineering, Computer Engineering and Informatics | - |
crisitem.author.faculty | Faculty of Engineering and Technology | - |
crisitem.author.orcid | 0000-0002-2818-0459 | - |
crisitem.author.parentorg | Faculty of Engineering and Technology | - |
crisitem.journal.journalissn | 0018-9340 | - |
crisitem.journal.publisher | IEEE | - |
Appears in Collections: | Άρθρα/Articles |
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