Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.14279/18175
Title: Organic semiconductor devices for X-ray imaging
Authors: Blakesley, James C. 
Keivanidis, Panagiotis E. 
Campoy-Quiles, Mariano 
Newman, Christopher R. 
Jin, Y. 
Speller, Robert 
Sirringhaus, Henning 
Greenham, Neil C. 
Nelson, Jenny 
Stavrinou, Paul N. 
Major Field of Science: Engineering and Technology
Field Category: Mechanical Engineering
Keywords: Organic semiconductors;Conjugated polymers;Digital radiography
Issue Date: 21-Sep-2007
Source: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2007, vol. 580, iss. 1, pp. 774-777
Volume: 580
Issue: 1
Start page: 774
End page: 777
Journal: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 
Abstract: We investigate the potential for replacing inorganic semiconductors with polymeric semiconductors in medical X-ray imaging applications. Polymeric semiconductors are soft and can be fabricated using techniques such as spin coating and jet printing, leading to reductions in fabrication costs for large-area arrays, easy integration of heterostructures and composite materials and the possibility of using flexible substrates. By using a combined cascaded linear systems and Monte-Carlo model to simulate the imaging system, we establish a set of semiconductor requirements for a feasible flat-panel imager (FPI). We have fabricated photodiodes and thin-film transistors (TFTs) out of a variety of polymer materials. Polymer photodiodes coupled to phosphor screens have shown a response to X-ray radiation with a good efficiency. Both transistors and photodiodes were sufficiently radiation hard for use in clinical imaging conditions. A composite phosphor-polymer material has been fabricated and has been found to be compatible with polymeric photodiodes. The composite material can be fabricated within a structure as part of the semiconductor fabrication process. © 2007 Elsevier B.V. All rights reserved.
ISSN: 01689002
DOI: 10.1016/j.nima.2007.05.105
Rights: © Elsevier
Type: Article
Affiliation : University College London 
University of Cambridge 
Imperial College London 
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