Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.14279/1528
DC FieldValueLanguage
dc.contributor.authorPatsalas, Panos-
dc.contributor.authorAbadias, Gregory-
dc.contributor.authorKoutsokeras, Loukas E.-
dc.date.accessioned2013-02-22T13:41:17Zen
dc.date.accessioned2013-05-17T05:22:46Z-
dc.date.accessioned2015-12-02T10:08:00Z-
dc.date.available2013-02-22T13:41:17Zen
dc.date.available2013-05-17T05:22:46Z-
dc.date.available2015-12-02T10:08:00Z-
dc.date.issued2010-11-25-
dc.identifier.citationSurface and coatings technology, 2010, vol. 205, no. 5, pp. 1324–1330en_US
dc.identifier.issn02578972-
dc.identifier.urihttps://hdl.handle.net/20.500.14279/1528-
dc.description.abstractComplex transition metal nitrides (TMN) have lately gained special attention in an effort to improve the properties of their binary counterparts. In this work we review a very wide range of binary and ternary transition metal nitrides of the form: TixTM1 − xN (TM = Zr,Hf,Nb,Ta,Mo,W) over the whole composition x range (0 < x < 1) grown by Pulsed Laser Deposition (PLD), Dual Ion Beam Sputtering (DIBS) and Magnetron Sputtering (MS). We identify the bonding mechanism and, despite the possible different valence electron configuration of the constituent elements, we show that TMNs are completely soluble to each other due to the hybridization of the d and sp electrons of the metals and nitrogen, respectively. Optical absorption bands are manifested due to the N-p → Me-d interband transition and the t2g → eg transition due to splitting of the metals’ d band, proving the partial ionic character of the bonds in TMNs. In addition, we consider the growth of Ti–Cu–N nanocomposites by PLD and MS. We investigate the difference in the atomic structure and bonding in both cases of ternary and nanocomposite nitrides, for sequential deposition of Ti and TM or Cu (achieved in PLD) or simultaneous deposition (achieved in DIBS, MS) and get insights for the kinetic effectsen_US
dc.formatpdfen_US
dc.language.isoenen_US
dc.relation.ispartofSurface and Coatings Technologyen_US
dc.rights© Elsevieren_US
dc.subjectBondingen_US
dc.subjectPhysical vapor depositionen_US
dc.subjectStructureen_US
dc.subjectTernary nitridesen_US
dc.titleElectronic and crystal structure and bonding in Ti-based ternary solid solution nitrides and Ti–Cu–N nanocomposite filmsen_US
dc.typeArticleen_US
dc.affiliationUniversity of Ioanninaen
dc.collaborationUniversity of Ioanninaen_US
dc.collaborationUniversité de Poitiersen_US
dc.subject.categoryMechanical Engineeringen_US
dc.subject.categoryMaterials Engineeringen_US
dc.journalsSubscriptionen_US
dc.countryGreeceen_US
dc.countryFranceen_US
dc.countryCyprusen_US
dc.subject.fieldEngineering and Technologyen_US
dc.publicationPeer Revieweden_US
dc.identifier.doi10.1016/j.surfcoat.2010.09.024en_US
dc.dept.handle123456789/54en
dc.relation.issue5en_US
dc.relation.volume205en_US
cut.common.academicyear2010-2011en_US
dc.identifier.spage1324en_US
dc.identifier.epage1330en_US
item.openairecristypehttp://purl.org/coar/resource_type/c_6501-
item.openairetypearticle-
item.cerifentitytypePublications-
item.grantfulltextnone-
item.languageiso639-1en-
item.fulltextNo Fulltext-
crisitem.journal.journalissn0257-8972-
crisitem.journal.publisherElsevier-
crisitem.author.deptDepartment of Mechanical Engineering and Materials Science and Engineering-
crisitem.author.facultyFaculty of Engineering and Technology-
crisitem.author.orcid0000-0003-4143-0085-
crisitem.author.parentorgFaculty of Engineering and Technology-
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