Please use this identifier to cite or link to this item: http://ktisis.cut.ac.cy/handle/10488/9449
Title: Towards high-performance and power-efficient optical NoCs using silicon-in-silica photonic components
Authors: Kakoulli, Elena 
Soteriou, Vassos 
Koutsides, Charalambos 
Kalli, Kyriacos 
Keywords: Nanophotonics;Networks-on-Chips;Photonic Interconnects;Silicon-in-Silica
Category: Electrical Engineering - Electronic Engineering - Information Engineering
Field: Engineering and Technology
Issue Date: 1-Jan-2015
Publisher: Institute of Electrical and Electronics Engineers Inc
Source: 9th International Workshop on Interconnection Network Architectures: On-Chip, Multi-Chip, INA-OCMC 2015; Amsterdam; Netherlands; 19 January 2015 through
metadata.dc.doi: 10.1109/INA-OCMC.2015.12
Abstract: Networks-on-Chips (NoCs) are meeting the growing inter-tile communication needs of multicore chips. However, achieving system scalability by utilizing hundreds of cores on-chip requires high performance, yet energy-efficient on-chip interconnects. As electrical interconnects are marred by high energy-to-bandwidth costs, threatening multicore scalability, on-chip nanophotonics, which offer high throughput, yet energy-efficient communication, are an alternative attractive solution. In this paper we consider silicon nanophotonic components that are embedded completely within the silica (SiO2) substrate as opposed to prior-art that utilizes die on-surface silicon nanophotonics. As nanophotonic components now reside in the silica substrate's subsurface, a greater portion of a chip's real estate can be utilized by cores and routers, while non-obstructive interconnect geometries offering higher network throughput can be implemented. First, we show using detailed simulations based on commercial tools that such silicon-in-silica (SiS) structures are feasible, and then demonstrate our proof of concept by utilizing a hybrid SiS-based photonic mesh-diagonal links topology that provides both higher effective throughput and throughput-to-power ratio versus prior-art.
URI: http://ktisis.cut.ac.cy/handle/10488/9449
ISBN: 978-147991870-6
Rights: © 2015 IEEE.
Type: Conference Papers
Appears in Collections:Δημοσιεύσεις σε συνέδρια/Conference papers

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